The Oxford Science Park (TOSP), one of Europe’s leading destinations for science and technology companies, has announced the sale of part of its estate to the Ellison Institute of Technology (EIT).
The transaction marks a significant step in a growing partnership between TOSP and EIT to strengthen discovery, innovation, and entrepreneurship in Oxford. The agreement covers much of the western section of the Park, including The Daubeny Project, and positions Oxford as a truly global centre for scientific research and development.
The sale enables EIT to expand its campus, while ensuring that TOSP continues to develop as a vibrant community for pioneering science and technology companies. Businesses based at the Park will benefit from closer collaboration with EIT and from ongoing investment in world-class facilities.
Yong Shen, Director of The Oxford Science Park, said:
“We are delighted to partner with EIT on their ambitious expansion plans, which will no doubt accelerate the growth of world-class science and innovation in Oxford. Our current and future occupiers will benefit from close proximity to the expanded EIT campus, creating new opportunities for collaboration and engagement with groundbreaking research.”
Professor Santa Ono, President of EIT, added:
“This investment is a sign of EIT’s commitment to Littlemore as a home for ambitious ground-breaking science. As EIT’s new President, I’m looking forward to watching our campus develop and grow over the next few years. We want to build a community of talented scientists who will work in an environment specially designed to encourage great ideas to flourish.”
Since its opening in 1991, The Oxford Science Park has become one of the UK’s most sought-after locations for science and technology businesses. Its combination of proximity to world-leading institutions, high-quality infrastructure, and a collaborative innovation ecosystem continues to drive growth across Oxfordshire.
For more information and visuals, visit the Ellison Institute of Technology news release.
